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Undergraduate Student
Name
Eunjik Kim
Research Interest
∙ Soft Robot
∙ Smart Materials and Structures
Journals
Lee, J.H.*, Kwak, H.*, Kim, E., and Han, M.W., 2025, “Recent Advances in Soft Acoustic Metamaterials: A Comprehensive Review of Geometry, Mechanisms, and System Responsiveness,” Applied Sciences, MDPI (Switzerland), Vol. 15, No. 14, 7910.
Conference participation
International
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Domestic
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Patent
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Awards
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